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80μm Heat Transfer Adhesive Powder

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80μm Heat Transfer Adhesive Powder

Name: 80μm Heat Transfer Adhesive Powder
Brand: Easun
Price: 1 USD

Quality 80μm Heat Transfer Adhesive Powder for sale

Brand Name : Easun

Model Number : ES203

Certification : Rosh, Reach

Place of Origin : China

MOQ : 20KG

Price : Negotiable

Payment Terms : T/T

Supply Ability : 4000000

Delivery Time : 3-8 working day

Packaging Details : 20KG/bag

Color : White

Composition : Copolyester

Appearance : White Powder

Melt Point(DSC) : 105-115 ℃

Melt Flow Index : 30±7 g/10min

Washable Property : 40℃ Excellent 60℃ Good 90℃Ordinary

Powder size range : 0-80μm; 80-170 μm;150-250 μm

Density : 1.20±0.02 g/cm³

Packaging : 20KG in one PE bag+Brown paper

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80μm Heat Transfer Adhesive Powder

Polyester Hot Melt Adhesive Powder In Textile

Product model: ES203

Description:This product is a copolyester thermoplastic powdery hot melt adhesive. Soft hand feel and certain resilience, excellent processability. Excellent adhesion to textiles, PVC, PC

Function:Heat transfer,Silk screen printing.

Physical Characteristics:

Property	Criterion
Appearance	White powder
Composition	Copolyester
Density ASTM D-792	1.20±0.02 g/cm³
Melt Point DSC	105-115 ℃
Melt Index ASTM D-1238	30±7 g/10min
Powder size range	0-80 um
	80-170 um
	150-250 um

Technical Parameters:

Bonding parameters (for reference only)	Temperature	125-140℃
	Press	1.5-3.0kg/cm2
	Time	10-18S
Washing Resistance	40℃	Excellent
	60℃	Good
	90℃	/

Packaging and Storage Conditions:

Packaging	20KG in one PE bag+Brown paper bag
Storage Conditions	Stored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.

1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.
2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.

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